Solder reflow plate runs off USB power but heats up to 350 degrees Celsius

Japanese storefront Shigezone has recently listed a USB PD (Power Delivery)-operated reflow oven. The top plate reaches a maximum temperature of 280 degrees Celsius at default settings or 350 degrees Celsius with modified settings, per a report from gdm.or.jp. The device retails for ¥4400 Japanese yen, which converts to roughly $29 USD before shipping and other import fees are applied.

The size of the top plate of this USB PD Reflow Plate is 55 x 55 millimeters, which is noted by the original shop page to be capable of “easily accommodating an Arduino Uno.” As long as one uses caution and the proper equipment, though, this could also be a useful device for home GPU solder reflow/repair or the reflowing of other BGA (ball grid array) chips. 



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