SMIC and Huawei could use quadruple patterning for China-made 5nm chips: Report

Huawei and presumably China’s Semiconductor Manufacturing International Co. (SMIC) have submitted patents for a chip production method called self-aligned quadruple patterning (SAQP). The ultimate aim is to produce chips on a 5nm-class process technology, according to a Bloomberg report. The very same method was a major reason for the failure of Intel’s 1st Generation 10nm-class process technology, but Huawei and SMIC have no choice but to use quadruple patterning as they do not have access to leading-edge production tools due to U.S. export rules. 

Usage of SAQP could enable SMIC to build chips on sub-10nm technologies (we are talking about SMIC’s rumored 5nm fabrication process) despite U.S. efforts to limit China’s capabilities in the field of advanced semiconductor production. In Intel’s case, SAQP technology was meant to eliminate reliance on high-end lithography, specifically extreme ultraviolet (EUV) lithography machines made by ASML. In the Huawei and SMIC case, quadruple patterning is the only technique that increases transistor density using the tools that the contract chipmaker already has.



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